Profaịlụ ọla kọpa dị obere (VLP-SP/B)

Usoro ọgwụgwọ obere micro-roughening na-abawanye nke ukwuu na mpaghara elu na-emetụtaghị ike, nke na-enye aka karịsịa maka ịbawanye ike nrapado.


Nkọwa ngwaahịa

Mkpado ngwaahịa

Usoro ọgwụgwọ obere micro-roughening na-abawanye nke ukwuu na mpaghara elu na-emetụtaghị ike, nke na-enye aka karịsịa maka ịbawanye ike nrapado.Na elu urughuru adhesion, ọ dịghị nchegbu nke ahụ na-ada oyi na-emerụ ahịrị.A na-edobe uru Rzjis mgbe emechara roughening na 1.0 µm na nghọta nke ihe nkiri mgbe emechara ya dịkwa mma.

Nkọwa

Ọkpụrụkpụ: 12um 18um 35um 50um 70um
Standard Obosara: 1290mm, Obosara nso: 200-1340mm, nwere ike ịkpụ dị ka kwa size arịrịọ.
Igbe igbe osisi
NJ:76 mm, 152 mm
Ogologo: ahaziri
Enwere ike ịnye ihe nlele

Atụmatụ

Foil a na-emeso ya bụ pink ma ọ bụ nwa electrolytic foil ọla kọpa nke ịdị ala dị ala.N'iji ya na foil ọla kọpa electrolytic mgbe niile, foil VLP a nwere kristal kacha mma, nke bụ ndị nwere ọnụ ala dị larịị, nwere ịdị elu nke 0.55μm, ma nwee uru dị ka nkwụsi ike nha ka mma yana isi ike dị elu.Ngwaahịa a na-adabara na ihe dị elu na ngwa ngwa dị elu, tumadi bọọdụ sekit na-agbanwe agbanwe, bọọdụ sekit ugboro ugboro, na bọọdụ sekit dị mma.
Profaịlụ dị ala
Ọnụahịa kasị elu nke MIT
Ezigbo etchability

Ngwa

2 Layer 3 oyi akwa FPC
EMI
Ụkpụrụ sekit dị mma
Nchaji ikuku ekwentị mkpanaaka
Osisi ugboro dị elu

Njirimara nke profaịlụ ọla kọpa dị obere

Nhazi

Nkeji

Ihe achọrọ

Usoro ule

Ọkpụrụkpụ aha

Um

12

18

35

50

70

IPC-4562A

Ibu Mpaghara

g/m²

107±5

153±7

285± 10

435±15

585± 20

IPC-TM-650 2.2.12.2

Ịdị ọcha

%

≥99.8

IPC-TM-650 2.3.15

isi ike

Akụkụ na-egbuke egbuke (Ra)

Sm

≤0.43

IPC-TM-650 2.3.17

Akụkụ Matte (Rz)

um

≤3.0

≤3.0

≤3.0

≤3.0

≤3.0

Ike ọdụdọ

RT(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

HT (180°C)

≥180

Ogologo oge

RT(23°C)

%

≥5

≥6

≥8

≥10

≥10

IPC-TM-650 2.4.18

HT (180 Celsius

≥6

≥6

≥6

≥6

≥6

Ike bee (FR-4)

N/mm

≥0.8

≥0.8

≥1.0

≥1.2

≥1.4

IPC-TM-650 2.4.8

lbs/n'ime

≥4.6

≥4.6

≥5.7

≥6.8

≥8.0

Pinholes & Porosity Ọnụọgụ

No

IPC-TM-650 2.1.2

Anti-oxidization RT(23°C) Days

180

 
HT (200°C)

Nkeji

30

/

5G Highfrequency Board Ultra Low Profile Copper Foil1

  • Nke gara aga:
  • Osote:

  • Dee ozi gị ebe a ziga anyị ya