Ọla ọla kọpa Hyper dị obere maka dijitalụ ọsọ dị elu

Ọkpụrụkpụ: 12um 18um 35um

Obosara ọkọlọtọ: 1290mm, Max.obosara 1340mm;nwere ike na-egbutu dị ka kwa size arịrịọ

Igbe igbe osisi


Nkọwa ngwaahịa

Mkpado ngwaahịa

Atụmatụ

Profaịlụ dị ala dị ala nwere ike bee dị elu yana ikike etch dị mma
Jiri teknụzụ na-akpachapụ anya dị ala, microstructure na-eme ka ọ bụrụ ihe magburu onwe ya iji tinye na sekit nnyefe dị elu
Foil a na-agwọ bụ pink

Ngwa a na-ahụkarị

Sekit nnyefe ugboro dị elu
Ebe ọdụ/Ihe nkesa
Dijitalụ dị elu
PPO/PPE

Njirimara ahụkarị nke profaịlụ Ọla kọpa dị oke ala

Nhazi

Nkeji

Usoro ule

Tusoro est

Ọkpụrụkpụ aha

Um

12

18

35

IPC-4562A

Ibu Mpaghara

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Ịdị ọcha

%

≥99.8

IPC-TM-650 2.3.15

Isi ike

Akụkụ na-egbuke egbuke (Ra)

Sm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Akụkụ Matte (Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

 

Ike ọdụdọ

RT(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

HT (180°C)

≥180

≥180

≥180

 

Ogologo oge

RT(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

HT (180°C)

≥6

≥6

≥6

 

Pinholes & Porosity

Nọmba

No

IPC-TM-650 2.1.2

Peel Ike

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

RT(23°C)

Ụbọchị

90

 

RT (200°C)

Nkeji

40

 
5G Highfrequency Board Ultra Low Profile Copper Foil1

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