Ihe mkpuchi ọla kọpa dị ala dị ala maka bọọdụ ugboro ugboro 5G

Ọkpụrụkpụ: 12um 18um 35um

Obosara ọkọlọtọ: 1290mm, Max.obosara 1340mm;nwere ike na-egbutu dị ka kwa size arịrịọ

Igbe igbe osisi


Nkọwa ngwaahịa

Mkpado ngwaahịa

A na-emeso foil raw raw foil, nke nwere elu na-egbukepụ egbukepụ nke nwere obere adịghị ike n'akụkụ abụọ ahụ, na-eji usoro micro-roughening nke JIMA Copper na-agwọ ya iji nweta ọrụ nkwụsịtụ dị elu yana ultra ala siri ike.Ọ na-enye arụmọrụ dị elu n'ọtụtụ ebe dị iche iche, site na bọọdụ sekit a na-ebipụta siri ike nke na-ebute ihe onwunwe nnyefe na ịmepụta ụkpụrụ dị mma na sekit ndị na-ebipụta na-agbanwe agbanwe nke na-ebute ụzọ nghọta.

Atụmatụ

Profaịlụ dị ala dị ala nwere ike bee dị elu yana ikike etch dị mma.
Hyper Low coarsening technology, na microstructure na-eme ka ọ bụrụ ihe magburu onwe ihe na-etinye na elu ugboro nnyefe sekit.
Foil a na-agwọ bụ pink.

Ngwa a na-ahụkarị

Sekit nnyefe ugboro dị elu
Ebe ọdụ/Ihe nkesa
Dijitalụ dị elu
PPO/PPE

Njirimara Njirimara nke Ultra Low Profile Ọla kọpa Foil

Nhazi

Nkeji

Usoro ule

Tusoro est

Ọkpụrụkpụ aha

Um

12

18

35

IPC-4562A

Ibu Mpaghara

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Ịdị ọcha

%

≥99.8

IPC-TM-650 2.3.15

Isi ike

Akụkụ na-egbuke egbuke (Ra)

Sm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

Akụkụ Matte (Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

 

Ike ọdụdọ

RT(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

HT (180°C)

≥180

≥180

≥180

 

Ogologo oge

RT(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

HT (180°C)

≥6

≥6

≥6

 

Pinholes & Porosity

Nọmba

No

IPC-TM-650 2.1.2

Peel Ike

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-oxidization

RT(23°C)

Ụbọchị

90

 

RT (200°C)

Nkeji

40

 
5G Highfrequency Board Ultra Low Profile Copper Foil1

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