Mpempe akwụkwọ ọla kọpa n'akụkụ okpukpu abụọ Maka HDI
●Ọkpụrụkpụ: 12um 18um 35um 70um
●Standard Obosara: 1290mm, Anyị nwere ike ịcha dị ka size chọrọ
●ID: 76 mm, 152 mm
●Ogologo: ahaziri
●Enwere ike ịnye ihe nlele;Oge nzipu: 7days
●Oge nnyefe: 15-20days
●Nkọwa ngwugwu: Mbupụ igbe osisi
●Oge: FOB, CIF.
●Ihe nkwụnye ụgwọ: 50% T / T nkwụnye ego, nkwụnye ego n'ihu tupu mbupu.
●Ngwá ọrụ mkpofu na-arụ ọrụ dị elu na-arụ ọrụ nrụpụta nke foil ọla kọpa.
●Foil ọla kọpa ejiri akụkụ abụọ mee ya
●Na elu njide ike ka laminate
●Direct multi-layer lamination
●Ezi etchability
●Foil a na-agwọ bụ pink
●Multilayer Ebipụtara Board Circuit
●Njikọ njikọ HDI (High Density Interconnector) maka PCB
| Nhazi | Nkeji | Ihe achọrọ | Usoro ule | ||||||
| Nhọpụta Foil |
| T | H | 1 | 2 | IPC-4562A | |||
| Ọkpụrụkpụ aha | um | 12 | 18 | 35 | 70 | IPC-4562A | |||
| Ibu Mpaghara | g/m² | 107±5 | 153±7 | 285± 10 | 585± 20 | IPC-TM-650 2.2.12 | |||
| Ịdị ọcha | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Rjọrọ njọ | Akụkụ na-egbuke egbuke (Ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
| Akụkụ Matte (Rz) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
| Ike ọdụdọ | RT(23°C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
| H.T.(180Celsius C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
| Ogologo oge | RT(23°C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
| H.T.(180Celsius C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
| Nguzogide | Ωg/m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | IPC-TM-650 2.5.14 | |||
| Ike bee (FR-4) | S akụkụ | N/mm | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
| lbs/n'ime | ≥5.1 | ≥6.3 | ≥8.0 | ≥8.0 | |||||
| M akụkụ | N/mm | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
| lbs/n'ime | ≥5.1 | ≥6.3 | ≥8.0 | ≥11.4 | |||||
| Pinholes & porosity | Nọmbas | No | IPC-TM-650 2.1.2 | ||||||
| Anti-oxidization | RT(23°C) | Ụbọchị | 180 | / | |||||
| H.T.(200Celsius C) | Nkeji | 40 | / | ||||||
Obosara ọkọlọtọ, 1295 (± 1) mm, Oke obosara: 200-1340mm.Mee dị ka akwa akwa arịrịọ onye ahịa si dị.
Foto foil kọpa PCB
